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Features

4.5 mm SMD Fast tripping resettable circuit protection Surface mount packaging for automated assembly Reduced component size and resistance Agency recognition:
The MF-MSMD Series is currently available, although not recommended for new designs. The MF-MSMF Series is preferred.
MF-MSMD Series - PTC Resettable Fuses
Electrical Characteristics
Tripped Power Dissipation
Ihold Model V max. Volts I max. Amps
Itrip
Resistance Ohms at 23 C RMin. R1Max.
Max. Time To Trip Amperes at 23 C Seconds at 23 C
Amperes at 23 C Hold Trip
Watts at 23 C Typ.
MF-MSMD010 MF-MSMD014 MF-MSMD020 MF-MSMD030 MF-MSMD050 MF-MSMD075 MF-MSMD110 MF-MSMD125 MF-MSMD150 MF-MSMD160 MF-MSMD200 MF-MSMD260
60.0 60.0 30.0 30.0 15.0 13.2 6.0 6.0 6.0 8.0 6.0 6.0
40 40 80 10 100 100 100 100 100 100 100 100
0.10 0.14 0.20 0.30 0.50 0.75 1.10 1.25 1.50 1.60 2.00 2.60
0.30 0.34 0.40 0.60 1.00 1.50 2.20 2.50 3.00 2.80 4.00 5.20
0.70 0.40 0.40 0.30 0.15 0.11 0.04 0.035 0.03 0.035 0.020 0.015
15.00 6.50 6.00 3.00 1.00 0.45 0.21 0.14 0.120 0.099 0.100 0.080
0.5 1.5 6.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0
1.5 0.15 0.06 0.10 0.15 0.20 0.30 0.4 0.5 2.0 3.0 5.0
1.0 1.0 1.0 1.2 1.2 1.2 1.2 1.5 1.5 1.5 1.5 1.5
Environmental Characteristics Operating/Storage Temperature ........................-40 C to +85 C Maximum Device Surface Temperature in Tripped State ................................................125 C Passive Aging......................................................+85 C, 1000 hours ....................................5 % typical resistance change Humidity Aging....................................................+85 C, 85 % R.H. 1000 hours....................5 % typical resistance change Thermal Shock ....................................................+85 C to -40 C, 20 times ..........................10 % typical resistance change Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change Condition A Test Procedures And Requirements For Model MF-MSMD Series Test Test Conditions Accept/Reject Criteria Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description Resistance ......................................In still air @ 23 C ............................................................Rmin R R1max Time to Trip ....................................At specified current, Vmax, 23 C ..................................T max. time to trip (seconds) Hold Current....................................30 min. at Ihold ..............................................................No trip Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning Solderability ....................................MIL-STD-202F, Method 208F..........................................95 % min. coverage
UL File Number ..................................E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 CSA File Number ................................CA110338 http://directories.csa-international.org/ Under "Certification Record" and "File Number" enter 110338-0-000 TUV Certificate Number......................R 02057213 http://www.tuvdotcom.com/ Follow link to "other certificates", enter File No. 2057213
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
Additional Features
Applications
High Density Circuit Board Applications: Hard disk drives PC motherboards PC peripherals Point-of-sale (POS) equipment PCMCIA cards
Patents pending
MF-MSMD Series - PTC Resettable Fuses
Product Dimensions
Model MF-MSMD010 MF-MSMD014 MF-MSMD020 MF-MSMD030 MF-MSMD050 MF-MSMD075 MF-MSMD110 MF-MSMD125 MF-MSMD150 MF-MSMD160 MF-MSMD200 MF-MSMD260
Packaging: 2000 pcs. per reel.
A Min. 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) Max. 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) Min. 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121)
B Max. 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) Min. 0.56 (0.022) 0.56 (0.022) 0.56 (0.022) 0.56 (0.022) 0.38 (0.015) 0.38 (0.015) 0.38 (0.015) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.25 (0.010)
C Max. 0.81 (0.032) 0.81 (0.032) 0.81 (0.032) 0.81 (0.032) 0.62 (0.024) 0.62 (0.024) 0.62 (0.024) 0.48 (0.019) 0.48 (0.019) 0.48 (0.019) 0.48 (0.019) 0.48 (0.019)
D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012)
UNIT = MM (INCHES)
Top and Bottom View A
Side View C
Solder Reflow Recommendations
300
Preheating
Soldering
Cooling
B
250 200 150 100 50 0 3.2 0.1 (0.126 .004) 160-220 10-20 Time (seconds) 120
D
Recommended Pad Layout 1.5 0.05 (.059 .002) 1.5 0.05 (.059 .002)
2.70 0.1 (.106 .004)
Terminal material: solder-plated copper Termination pad solderability: Meets EIA Specification RS-186-9E, ANSI/J-STD-002 Category 3.
Note: * MF-MSMD models can be wave soldered and reworked. * If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
Temperature (C)
MF-MSMD Series - PTC Resettable Fuses
Typical Time to Trip at 23 C
100
MF-MSMD200
MF-MSMD010
How to Order
MF - MSMD 075 - 2
Multifuse(R) Product Designator Series MSMD = 4.5 mm Surface Mount Component Hold Current, Ihold 010-260 (0.10 Amps - 2.60 Amps) Packaging Packaged per EIA 481-1 -2 = Tape and Reel
10
Time to Trip (Seconds)
MF-MSMD030
1
Typical Part Marking
0.1
MF-MSMD260
Represents total content. Layout may vary.
PART IDENTIFICATION MANUFACTURER'S TRADEMARK
0.01
MF-MSMD014
MF-MSMD160 MF-MSMD150 MF-MSMD125 MF-MSMD110 MF-MSMD075
075
0A
DATE CODE WEEK 1 OF 2000 = 0A (YEAR & WEEK) WEEK 27 OF 2000 = A0 (WEEK & YEAR)
MF-MSMD020
0.001 0.1 1
MF-MSMD050
10
100
Fault Current (Amps)
Thermal Derating Chart - Ihold / Itrip (Amps)
Ambient Operating Temperature Model MF-MSMD010 MF-MSMD014 MF-MSMD020 MF-MSMD030 MF-MSMD050 MF-MSMD075 MF-MSMD110 MF-MSMD125 MF-MSMD150 MF-MSMD160 MF-MSMD200 MF-MSMD260 -40 C 0.16 / 0.32 0.23 / 0.52 0.29 / 0.58 0.44 / 0.88 0.77 / 1.54 1.15 / 2.30 1.59 / 3.18 1.80 / 3.61 2.17 / 4.34 2.30 / 5.00 3.08 / 6.14 4.00 / 7.98 -20 C 0.14 / 0.28 0.19 / 0.45 0.26 / 0.52 0.39 / 0.78 0.68 / 1.36 1.01 / 2.02 1.43 / 2.86 1.63 / 3.25 1.95 / 3.90 2.20 / 4.40 2.71 / 5.39 3.52 / 7.01 0 C 0.12 / 0.24 0.17 / 0.40 0.23 / 0.46 0.35 / 0.70 0.59 / 1.18 0.88 / 1.76 1.26 / 2.52 1.43 / 2.86 1.72 / 3.44 1.90 / 3.80 2.35 / 4.62 3.06 / 6.09 23 C 0.11 / 0.22 0.14 / 0.34 0.20 / 0.40 0.30 / 0.60 0.50 / 1.00 0.75 / 1.50 1.10 / 2.20 1.25 / 2.50 1.50 / 3.00 1.60 / 2.80 2.00 / 4.01 2.60 / 5.15 40 C 0.08 / 0.16 0.12 / 0.29 0.17 / 0.34 0.26 / 0.52 0.44 / 0.88 0.65 / 1.30 0.95 / 1.90 1.08 / 2.16 1.30 / 2.59 1.45 / 2.90 1.80 / 1.61 2.34 / 4.64 50 C 0.07 / 0.14 0.10 / 0.25 0.15 / 0.30 0.23 / 0.46 0.40 / 0.80 0.60 / 1.20 0.87 / 1.74 0.99 / 1.98 1.18 / 2.37 1.30 / 2.60 1.60 / 3.19 2.08 / 4.13 60 C 0.06 / 0.12 0.09 / 0.23 0.14 / 0.28 0.21 / 0.42 0.37 / 0.74 0.55 / 1.10 0.80 / 1.60 0.91 / 1.82 1.09 / 2.18 1.15 / 2.30 1.50 / 2.98 1.95 / 3.87 70 C 0.05 / 0.10 0.08 / 0.21 0.12 / 0.24 0.18 / 0.36 0.33 / 0.66 0.49 / 0.98 0.71 / 1.42 0.81 / 1.62 0.97 / 1.94 1.03 / 2.06 1.07 / 2.12 1.39 / 2.74 85 C 0.03 / 0.06 0.06 / 0.16 0.10 / 0.20 0.15 / 0.30 0.29 / 0.58 0.43 / 0.86 0.60 / 1.20 0.68 / 1.36 0.82 / 1.64 0.91 / 1.82 0.80 / 1.58 1.04 / 2.05
MF-MSMD SERIES, REV. R, 09/05 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
MF-MSMD, MF-USMD & MF-ESMD Series Tape and Reel Specs
MF-MSMD Series per EIA-481-1
12.0 0.30 (0.472 0.012) 4.0 0.10 (0.157 0.004) 8.0 0.10 (0.315 0.004) 2.0 0.05 (0.079 0.002) 3.66 0.15 (0.144 0.006) 4.98 0.10 (0.196 0.004) 5.9 (0.232) 1.5 + 0.10/-0.00 (0.059 + 0.004/-0) 5.5 0.05 (0.217 0.002) 1.75 0.10 (0.069 0.004) 10.25 (0.404) 0.6 (0.024) 0.1 (0.004) 0.95 0.10 (0.037 0.004) 390 (15.35) 160 (6.30)
Tape Dimensions W P0 P1 P2 A0 B0 B1 max. D0 F E1 E2 min. T max. T1 max. K0 Leader min. Trailer min. Reel Dimensions A max. N min. W1 W2 max.
MF-USMD Series per EIA 481-1
8.0 0.30 (0.315 0.012) 4.0 0.10 (0.157 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) MF-USMD005,010,020: MF-USMD035,050,075,110: 2.93 0.15 2.76 0.10 (0.115 0.006) (0.109 0.004) MF-USMD005,010,020: 3.5 0.1 (0.138 0.004) MF-USMD035,050,075,110: 3.56 0.1 (0.140 0.004)
MF-ESMD Series per EIA 481-2
24.0 0.3 (0.945 0.012) 4.0 0.1 (0.157 0.004) 8.0 0.1 (0.315 0.004) 2.0 0.1 (0.079 0.004) 5.65 0.1 (0.222 0.004) 11.86 0.1 (0.467 0.004) 20.1 (0.791) 1.5 + 0.1/-0.0 (0.059 + 0.004/-0) 11.5 0.10 (0.453 0.004) 1.75 0.10 (0.069 0.004) 22.25 (0.876) 0.6 (0.024) 0.1 (0.004) 0.85 0.1 (0.033 0.004) 390 (15.35) 160 (6.30)
4.35 (0.171) 1.50 + 0.1/-0.0 (0.059 + 0.004/-0) 3.5 0.05 (0.138 0.002) 1.75 0.10 (0.069 0.004) 6.25 (0.246) 0.6 (0.024) 0.1 (0.004) MF-USMD005,010,020: MF-USMD035,050,075,110: 0.75 0.10 1.07 0.10 (0.030 0.004) (0.042 0.004) 390 (15.35) 160 (6.30)
185 (7.28) 50 (1.97) 12.4 + 2.0/-0.0 (0.488 + 0.079/-0.0) 18.4 (0.724)
185 (7.28) 50 (1.97) 8.4 + 1.5/-0.0 (0.331 + 0.059/-0) 14.4 (0.567)
360 (14.17) 60 (2.36) 24.4 + 2.0/ -0.0 (0.961 + 0.079/-0) 30.4 (1.20) MM (INCHES)
P0 T D0 P2 E1
UNIT =
W2(MEASURED AT HUB)
COVER TAPE F B1 B0 K0 T1 P1 A0 W1(MEASURED AT HUB) E2 W A N(HUB DIA.)
Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.

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